Lenovo Interview Questions
& Process

Applied via referral link. Got an invite 3 weeks later for a screening call with TA. At the end of the call, scheduled an interview with the HM. Interviewed with HM two days later. Screening call was mostly about my experience and interest in the role. HM interview was more informational about the role and less interview-like. When scheduling the next interview, I mentioned I was flexible with my availability because I'm currently on maternity leave. The TA started to talk me out of the role, asking if I was sure I was up to it and mentioning 8PM meetings and a more 'chill' role. After the HM interview, the TA said they wanted to schedule another panel interview, but the team would be out of office the following week. They said they'd get back to me to schedule it. A week later I followed up, and then another week after that I followed up again, receiving no communication. A full month later, I got an email saying the role was moved to be based in China.

Had an interesting and informative discussion with the hiring manager, though the overall interview experience could be better. HR sent WhatsApp messages with guidance during the interview, which was a bit unusual and distracting. The meeting started late after a follow-up email, and most people had their cameras off, making it less engaging. After the interview, there was a long silence of about six weeks with no updates, even though the same role reappeared on job boards. Better communication during this time would have been appreciated. Also, there's no clear way to remove candidate data from their system, which is a privacy concern they could address. Despite these points, I appreciate the opportunity to talk with the team and hope the process improves for others.

Man, the interview at Lenovo’s Cyberport office was intense but honestly pretty cool. The lead engineer didn't hold back and went straight for the technical aspects. He gave me a laptop chassis and asked me to point out possible stress points and describe how I would optimize the airflow path to avoid thermal throttling. We spent a good amount of time debating material fatigue in hinge designs. He also questioned me heavily on DFM (Design for Manufacturing), basically asking how we would mass-produce it in Shenzhen without costs going through the roof. The atmosphere was professional but fast-paced. He seemed less interested in my grades from CityU and more in how I’d handle a real-world hardware failure under pressure. By the end, my brain was fried, but I think I did well on the logic behind my cooling system proposal.

The interview process started with an initial call with the recruiter, followed by a meeting with the hiring manager and a peer in China. Oddly, the recruiter sent a reconnect invite a few hours before the meeting, asking how the hiring manager interview went, as she thought it had already happened. When I joined the call, it was only with the hiring manager, even though an email stated the absent peer would be leading the interview. The recruiter then scheduled another meeting a few days later, which was postponed to the following week and then cancelled without any explanation. It was incredibly unorganized and unprofessional.