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TSMC Silicon / Chip Design Engineer Interview Questions
& Process

Real candidates share what happened, how many rounds they had,
and how the experience turned out.

Based on 17 interview experiences · FREE TO READ

1.9 Rounds average
Average Typical difficulty
64.7% Positive experience

Candidate interview experiences

First-hand accounts from people who interviewed at TSMC.

Showing 3 of 17
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SRAM Design Engineer

Engineering · nearly a year ago

Mid Difficult Neutral experience No offer 3 rounds
Interview process
Technical screen
Interview formats
Technical Coding

It was a 3 round interview process, with each round lasting 45 minutes. The questions covered my resume, logic design, circuit design, finite state machines, the 6T and 8T SRAM core, and transistors. The questions were in-depth and required some careful thought.

Confirmed questions1 question
  • Can you describe at least five different methods for implementing read assist?
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TSMC

Digital Design Engineer

Engineering · a year ago

Intern Average Neutral experience No offer 1 round
Interview process
Technical screen
Interview formats
Technical

The interview was all about technical problems, focusing on MOSFET basics. They asked about the function of capacitance and the ID/V curve of a MOS. They also asked how things were going recently.

Confirmed questions1 question
  • What would happen to the electric field if the capacitor thickness was doubled?
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TSMC

Physical Design Engineer

Engineering

Entry Average Positive experience Accept offer 1 round
Interview process
Technical screen
Interview formats
Technical Behavioral

It was good , technical interview on questions related to my internship mostly which was on physical design ( basic questions and concepts related to that ) ….. also questions on whether I am willing to Relocate to Taiwan and also my learning from my internship experience

Confirmed questions4 questions
  • Could you explain the function of boundary and tap cells within the PnR process?
  • Tell me about the fundamental questions and concepts concerning physical design.
  • Would you be open to relocating to Taiwan?

TSMC Silicon / Chip Design Engineer Interview Questions

Quoted word for word from TSMC interview reports.

What would happen to the electric field if the capacitor thickness was doubled?

Read reports

Can you draw a D latch using transmission gates and describe its operation?

Read reports

Between NAND and NOR, which would you choose for circuit construction and why?

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Could you explain the function of boundary and tap cells within the PnR process?

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What are your thoughts on STA, PNR, and the Antenna effect?

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Formats, difficulty and experience

Across all 17 TSMC interview reports.

Interview formats

Technical 47.1%
Behavioral 32.4%
Presentation 11.8%
Coding 5.9%
Group 2.9%

Interview difficulty

Easy 11.8%
Average 70.6%
Difficult 17.6%

Candidate experience

Neutral 35.3%
Positive 64.7%