Intel Corporation Engineer Interview Questions
& Process
Real candidates share what happened, how many rounds they had,
and how the experience turned out.
Based on 197 interview experiences · FREE TO READ
Candidate interview experiences
First-hand accounts from people who interviewed at Intel Corporation.
Intel Corporation
Engineer
Mid Average Neutral experience No offer 2 rounds
Interview process
Recruiter call Technical screen
Interview formats
Coding Technical
Had a phone call first and then a technical interview over Zoom with two interviewers. They asked questions similar to LeetCode style. The interview was average, but one interviewer had bad service and kept getting disconnected, which made it hard to talk and caused confusion.
Confirmed questions1 question
- Medium-difficulty LeetCode-style question
Intel Corporation
Packaging Engineer
Entry Difficult Positive experience Accept offer 3 rounds
Interview process
Technical screen Technical screen Recruiter call
Interview formats
Technical Technical Behavioral
The interview process involved two technical rounds and then an HR round. The first technical round focused on the fundamentals of ECE subjects like Networks, Signals and Systems, and primarily Electronic Devices and Circuits (EDC). The second round covered Transmission Lines and EMT, followed by Signal Integrity and Power Integrity concepts.
Confirmed questions8 questions
- Can you explain how transmission lines function?
- What is crosstalk and what steps can be taken to reduce it?
- Describe the path of current flow from the top to the bottom through a via.
Intel Corporation
Engineer
Mid Average Positive experience No offer 5 rounds
Interview process
Technical screen Panel Background check
Interview formats
Technical Coding
I interviewed with five people, one after another. Each person asked different questions that were unique and tested my knowledge of basic computer chip design, implementation, and optimization. They asked follow-up questions if my answers weren't quite right. It wasn't a bad experience. The team had a round table review the next day and then emailed me about the next steps. I didn't get the offer, but they did send my resume to another group. That's pretty much how it went.
Confirmed questions1 question
- Can you explain ASIC power leakage and voltages?
Intel Corporation Engineer Interview Questions
Quoted word for word from Intel Corporation interview reports.
“What is the power dissipated in 2 light bulbs under different conditions?”
Read reports →“How is the short circuit current dependent on the rise and fall times of an inverter?”
Read reports →“Given two sets of coordinates, for each coordinate in one set, determine the closet coordinate in the other set. (determine in nlogn complexity)”
Read reports →“Given a set of polygons, determine if the distance between them crosses a given lamda value (DRC related VLSI question)”
Read reports →“What is the maximum slew rate that can be allowed when using lock-up latches?”
Read report →“Can you explain how to construct an inverter using only a single NAND gate?”
Read report →“Given a coordinate, how would determine if a coordinate lies within a set of coordinate that form a polygon”
Read report →“How would you represent a set of polygons using a data structure - basically a layer in VLSI”
Read report →“What is the inverted temperature effect on STA, and how does it impact delay below 65nm technology? Also, how does STA function under these temperature conditions at different corners?”
Read report →Formats, difficulty and experience
Across all 197 Intel Corporation interview reports.